[特邀报告]Inhibition of leidenfrost phenomenon on hydrophobic surfaces

Inhibition of leidenfrost phenomenon on hydrophobic surfaces
编号:94 稿件编号:95 访问权限:仅限参会人 更新:2024-10-14 10:56:07 浏览:148次 特邀报告

报告开始:2024年10月20日 14:20 (Asia/Shanghai)

报告时间:20min

所在会议:[S1] Surface Micro-Nano Fabrication and Additive Manufacturing » [S1C] Session 1C

暂无文件

摘要
The Leidenfrost phenomenon, wherein a droplet is levitated by its own vapor when placed on a heated surface, plays a crucial role in droplet manipulation, spray cooling, and drag reduction. The essential emergence sign of the Leidenfrost phenomenon is the formation of continuous vapor film beneath the droplet. Rough hydrophobic surfaces are believed to accelerate vapor film formation due to their low adhesion energy and reduced liquid-solid contact area. Therefore, hydrophobic surfaces usually have lower Leidenfrost points than other surfaces, which induces a deterioration of heat transfer between droplets and surfaces. However, here we found exceptions. Through high-speed imaging, we found that the hydrophobic doubly reentrant structures can significantly suppress the emergence of the Leidenfrost phenomenon between a water droplet and a superheated surface. Specifically, a superhydrophobic surface rendered with doubly reentrant pillars can prevent the appearance of the Leidenfrost phenomenon until ~363 °C, while a hydrophobic surface decorated with doubly reentrant cavities can inhibit the Leidenfrost phenomenon even when the surface temperature reaches 440 °C. Experimental and theoretical investigations were performed to reveal the physics of these counterintuitive phenomena. These findings advance our concepts of the Leidenfrost phenomenon and may open a door to enhance heat transfer on hydrophobic surfaces.
关键字
Leidenfrost Phenomenon,Micro/nano Fabrication,Surface Structures,Interfacial Tension,Heat Transfer
报告人
Meng Shi
Associate Professor Xi'an Jiaotong University, China

稿件作者
Meng Shi Xi'an Jiaotong University
发表评论
验证码 看不清楚,更换一张
全部评论
段金弟:13971036507  
蒋 超:18971299299 邮箱:icse2024@126.com
李昱鹏:15842490631  
车宏龙:13555943451  
刘明明:19862516876, 邮箱:mmliu@sdut.edu.cn
朱   建:15810878528, 邮箱:zhujian@sdut.edu.cn
张秀丽:15064351998, 邮箱:zhangxiulli@163.com
郭前建:13969397001,  
注册参会 提交稿件